Paste designed for soldering SMD components in production processes that do not include washing phase. It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.
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