Solder paste
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Electronics
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Electrotechnics
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Solder paste acc. to DIN EN 29454-1 1.1.2.C is a medium activity flux in the form of a paste, based on rosin and organic halogen activator, for easy soldering of copper, silver, zinc and nickel items. It is used in lead-tinning and soldering in the radio and telecommunication technology as well as in installation of electrical equipment. Post-soldering flux residues do not cause corrosion of non-ferrous metals and may remain on the joints. (it is advisable to wash them with alcohol remover). The product is used where rosin is not enough.
Metal bottle 20g
| Properties | Value |
|---|---|
| Capacity | 20g |
| Package | Metal bottle |
| Number of pcs in the package | 50 |
| Product code | ART.AGT-036 |
| Bar code | 5901764327141 |
Metal bottle 40g
| Properties | Value |
|---|---|
| Capacity | 40g |
| Package | Metal bottle |
| Number of pcs in the package | 50 |
| Product code | ART.AGT-037 |
| Bar code | 5901764329046 |
Metal bottle 100g
| Properties | Value |
|---|---|
| Capacity | 100g |
| Package | Metal bottle |
| Number of pcs in the package | 30 |
| Product code | ART.AGT-038 |
| Bar code | 5901764329053 |
| Capacity | Package | Number of pcs in the package | Art. code | Bar code | |
|---|---|---|---|---|---|
 | 20g | Metal bottle | 50 | ART.AGT-036 | 5901764327141 |
 | 40g | Metal bottle | 50 | ART.AGT-037 | 5901764329046 |
 | 100g | Metal bottle | 30 | ART.AGT-038 | 5901764329053 |
