TWO-COMPONENT SILICONE ENCAPSULATING COMPOUND 021

Brands

  • Electronics
  • Electrotechnics

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The product is a liquid encapsulating compound, two-component, thermally conductive. Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch.

Metal box 100g
Properties Value
Capacity 100g
Package Metal box
Number of pcs in the package 2
Product code ART.AGT-220
Bar code 5901764325147
Capacity Package Number of pcs in the package Art. code Bar code
100g Metal box 2 ART.AGT-220 5901764325147

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Phone number

+48 86 274 13 42

Contact details:

AG Termopasty
Grzegorz Gąsowski
ul. Kolejowa 33 E,
18-218 Sokoły
NIP 966-17-67-714

Opening hours:

Mon - Fri: 8:00am – 4:00pm
Sat – Sun: closed


TWO-COMPONENT SILICONE ENCAPSULATING COMPOUND 021