Two-component silicone potting compound 029


  • Electronics
  • Electrotechnics

Need more information?

The product is a liquid encapsulating compound, two-component, thermally conductive. Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch.

silicone potting compound 029 Metal box 100g
PackageMetal box
Number of pcs in the package4
Product codeART.AGT-221
Bar code5901764325154
Metal box 1kg
PackageMetal box
Number of pcs in the package1
Product codeART.AGT-263
Bar code5901764325604
CapacityPackageNumber of pcs in the packageArt. codeBar code
silicone potting compound 029100gMetal box4ART.AGT-2215901764325154
1kgMetal box1ART.AGT-2635901764325604

Phone number

+48 86 274 13 42

Contact details:

AG Termopasty
Grzegorz Gąsowski
ul. Kolejowa 33 E,
18-218 Sokoły
NIP 966-17-67-714

Opening hours:

Mon - Fri: 8:00am – 4:00pm
Sat – Sun: closed

Two-component silicone potting compound 029