Two-component silicone potting compound 019


  • Electronics
  • Electrotechnics

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The product is a liquid encapsulating compound, two-component. Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch.

Metal box 100g
PackageMetal box
Number of pcs in the package4
Product codeART.AGT-201
Bar code5901764327899
Metal box 1kg
PackageMetal box
Number of pcs in the package1
Product codeART.AGT-261
Bar code5901764325581
CapacityPackageNumber of pcs in the packageArt. codeBar code
100gMetal box4ART.AGT-2015901764327899
1kgMetal box1ART.AGT-2615901764325581

Phone number

+48 86 274 13 42

Contact details:

AG Termopasty
Grzegorz Gąsowski
ul. Kolejowa 33 E,
18-218 Sokoły
NIP 966-17-67-714

Opening hours:

Mon - Fri: 8:00am – 4:00pm
Sat – Sun: closed

Two-component silicone potting compound 019