Two-component silicone potting compound 011

Brands

  • Electronics
  • Electrotechnics

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The product is a liquid encapsulating compound, two-component. Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch.

Metal box 100g
PropertiesValue
Capacity100g
PackageMetal box
Number of pcs in the package4
Product codeART.AGT-219
Bar code5901764325130
Metal box 1kg
PropertiesValue
Capacity1kg
PackageMetal box
Number of pcs in the package1
Product codeART.AGT-260
Bar code5901764325574
CapacityPackageNumber of pcs in the packageArt. codeBar code
100gMetal box4ART.AGT-2195901764325130
1kgMetal box1ART.AGT-2605901764325574

Phone number

+48 86 274 13 42

Contact details:

AG Termopasty
Grzegorz Gąsowski
ul. Kolejowa 33 E,
18-218 Sokoły
NIP 966-17-67-714

Opening hours:

Mon - Fri: 8:00am – 4:00pm
Sat – Sun: closed


Two-component silicone potting compound 011